Electronics Forum | Wed Feb 05 21:24:35 EST 2003 | davef
Stephen's correct. Radiased outer corners on 0402 pads really do seem to improve things. We aim to try "squared-up semicircles".
Electronics Forum | Thu Aug 27 16:44:11 EDT 2015 | esoderberg
I have that article. While some of the information is helpful, there is no direction as to the length and width of the step to achieve blade deflection to reduce paste.
Electronics Forum | Tue Apr 10 10:21:06 EDT 2018 | slthomas
Dave, that's a cool idea and sounds like something that would actually work. I'd be tempted to go with oversized pads to increase the holding force. Unfortunately as an EMS we would have to work that through the customer approval system and as usual
Electronics Forum | Tue Apr 10 10:33:08 EDT 2018 | davef
Oh, I just remembered the other thing that I wanted to mention ... Do the pads match the component leads?
Electronics Forum | Wed Apr 11 11:55:54 EDT 2018 | slthomas
Yes - every dimension that I measured on the gerbers checks out against datasheet. Presumably the parts match it as well....?
Electronics Forum | Mon Apr 16 16:24:20 EDT 2018 | slthomas
Amazingly enough, every one of these held fast where we placed them with a paste brick sized 1:1 with the thermal pad, no sectioning. Yes, there were voids, but we can live with that in this application.
Electronics Forum | Wed Apr 18 14:17:48 EDT 2018 | esoderberg
Further divide the ground block into more than 4 panes. Also think about using, assuming you have good placement of using Loctite chip bonder on two opposing corners. Lots of ways to get good results
Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas
We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen
Electronics Forum | Sat Mar 18 07:33:34 EST 2000 | Dave F
Jack: Two concerns with column devices: 1 Coplaniarity of the device and the board. 2 Adequate solder that you mentioned, becuase the columns will not be reflowing and you need to cloatthem with solder. You didn't describe your aperture, but even
Electronics Forum | Tue Apr 10 08:37:36 EDT 2018 | davef
Hi Steve ... I found nothing in the manufacturers "paper" to help. Comments are: * I agree. No blobs. Solder on the thermal pad should me minimized. Too much solder will float the component. Old timers used to talk about 50-80% coverage. * If you'
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